DISCO CORPORATION provides glass processing solutions, test cuts, and equipment.

LEAF Processing

LEAF (Laser Enhanced Ablation Filling)

Separation method utilizing laser ablation

Enables high aspect ratio processing

Ultra-narrow cutting margin

Achieves high-perpendicularity cutting for materials difficult to process to the same quality using mechanical processing

Produces high mechanical strength even with ultra-thin workpieces

Supports maskless processing

Ultra-fine Process of Quartz, Glass, and Crystal Using Free-Shape Laser Processing

LEAF + etching
bonded glass
free-shape processing
line processing

Processing of Wide-Bandgap Substrates, Including Sapphire, SiC, Diamond, and GaN

Material : sapphire
Size: 35 mm x 35 mm x 1.0 mm thick
Diameter: φ30 mm
Material : SiC
Size: 6 inches x 0.35 mm thick
Index size: 10 mm x 10 mm
Material : diamond
Size : 10 mm x 10 mm x 0.5 mm thick
Index size : 2.5 mm x 2.5 mm

Precision Processing Equipment Used

Please contact your nearest DISCO office for more details.
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