LEAF 2.0 (Laser Enhanced Ablation Filling 2.0)

Separation method utilizing laser ablation

Enables high-aspect ratio processing

Ultra-narrow cutting margin

Ultra-fine Process of Quartz, Glass, and Crystal Using Free-Shape Laser Processing

Achieves high-perpendicularity processing of hard-to-process maretials

Achieves high-perpendicularity processing of hard-to-process maretials

Compatible with the mask-less process

Process handling equipment

Fully Automatic Laser Saw

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  DFL7161

  Machine for Ablation Processing

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  DFL7362

  Machine for Stealth Dicing