DISCO CORPORATION provides glass processing solutions, test cuts, and equipment.
LEAF Processing
LEAF (Laser Enhanced Ablation Filling)
Separation method utilizing laser ablation
Enables high aspect ratio processing
Ultra-narrow cutting margin
Achieves high-perpendicularity cutting for materials difficult to process to the same quality using mechanical processing
Produces high mechanical strength even with ultra-thin workpieces
Supports maskless processing
Ultra-fine Process of Quartz, Glass, and Crystal Using Free-Shape Laser Processing
LEAF + etching
bonded glass
free-shape processing
line processing
Processing of Wide-Bandgap Substrates, Including Sapphire, SiC, Diamond, and GaN
Material : sapphire
Size: 35 mm x 35 mm x 1.0 mm thick
Diameter: φ30 mm
Size: 35 mm x 35 mm x 1.0 mm thick
Diameter: φ30 mm
Material : SiC
Size: 6 inches x 0.35 mm thick
Index size: 10 mm x 10 mm
Size: 6 inches x 0.35 mm thick
Index size: 10 mm x 10 mm
Material : diamond
Size : 10 mm x 10 mm x 0.5 mm thick
Index size : 2.5 mm x 2.5 mm
Size : 10 mm x 10 mm x 0.5 mm thick
Index size : 2.5 mm x 2.5 mm
Precision Processing Equipment Used
Processing Services
DISCO provides custom manufacture of semiconductor wafers, various electronic components, etc. through separation
processing and laser processing using DISCO’s unique processing technologies, including LEAF, in the form of Dicing and
Grinding Services.
For more details, please contact your DISCO sales representative.